Sil-pad is one kind of clean and efficient TIM material for a wide range of electronic components, or between other heat-generating devices and chassis.
Our R&D center enables us to work closely and provide not only products but also best solution to our clients.
■ ROHS Compliant: Yes
■ UL recognized: Yes
Thermal conductivity: 1.6 W/m·K
Excellent thermal performance
Low thermal resistance
Available in die-cut parts, sheets and rolls
HDG400, sil-pad, is one kind of composited material. HDG400’s carrier is fiberglass and its matrix is silicone rubber.
HDG400 has excellent thermal conductivity and flame retardant performance which
allows it to be applied on different kinds of surfaces.
HDG400 is mainly placed between power devices and heat spreaders.
Our sil-pad is available in die-cut parts, sheets and rolls, meeting your demands of various heat-spreading, such as TO-220, TO-247, etc
Transistor Outline Package