Thermal Conductive Interface Material
Solution Supplier
Thermal Gel
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HD-RT200H



HD-RT200H

Features

One component adhesive/sealant

Cures at room temperature when exposed to moisture in the air.

Alkoxy cure system,

Non-sag, paste consistency

UL94 V-0

RoHs Compliance: Yes

Applications:

Sealing lids and housings

General sealing and component protection

Processing

All surfaces must be clean and dry. Degrease and wash off any contaminants that could impair adhesion. Suitable solvents include isopropyl alcohol, acetone or methyl ethyl ketone. Good unprimed adhesion may be obtained on a variety of substrates, including enameled and painted steel, aluminum, ceramics, glass and certain plastics. Substrates to which good adhesion is normally not obtained include PTFE, PE, PP and related materials. Apply a bead of HD-RT200 H Adhesive/ Sealant to one of the prepared surface, and then quickly cover with the substrate to be bonded. Very deep sections, will take longer to cure completely.

Cure time

After skin formationcure continues inward from the surface. Cure time is extended at lower humidity levels. Before handling and packaging bonded components, users are advised to wait a sufficiently long time to ensure that the integrity of the adhesive seal is not affected. This will depend on many factors and should be determined by the user for each specific application.

Packaging

100g/blister, 300ml cartridge.

Usable life and storage

HD-RT200 H has a shelf life of 12 months from the date of manufacture when stored at or below 30in the original un opened containers.