■ Features and Benefits
Thermal conductivity: 2.0 W/m·K
Excellent thermal performance
Electrical insulating characteristics
High tack surface reduces contact resistance
Available in die-cut parts and sheets
Available with reinforcement carrier or non-reinforced one
■ Thermal Pad (Gap pad)
We has been engaging in TIM material for more than 18 years. As a leading manufacturer, we continually develop and manufacture gap-pad to meet demands of clients. We're the only one manufacturer which is able to produce 8W/m·k conductivity gap-pad in China.
HD-FS200 thermal pads, which are made from soft silicone conductive materials, have excellent thermal and electrical insulating performance.
HD-FS200 thermal pad is soft and flexible which could reduce contact resistance between heat generators and heat sinks, transferring heat to heat spreaders effectively.
Between an IC and a heat sink
Between a semiconductor and heat sink
Between power supply module and heat spreader
Between heat-generating devices and chassis
Hard drive cooling
Signal amplifier cooling