Thermal Conductive Interface Material
Solution Supplier
Thermal Pad
Thermal Pad Thermal Grease Thermal Gel Silicone Gel Silicone Cloth Silicone Thermal Cap
HD-FS250 Series thermal pad


Features and Benefits

 Thermal conductivity: 2.5 W/m·K

 Excellent thermal performance

 Electrical insulating characteristics

 Low oil-bleeding

 High tack surface reduces contact resistance

 Available in die-cut parts and sheets

 Available with reinforcement carrier or non-reinforced one


■  Thermal Pad (Gap pad)

We has been engaging in TIM material for more than 18 years. As a leading manufacturer, we continually develop and manufacture gap-pad to meet demands of clients. We're the only one manufacturer which is able to produce 8W/m·k conductivity gap-pad in China.

HD-FS250 thermal pads, which are made from soft silicone conductive materials, have excellent thermal and electrical insulating performance.

HD-FS250 thermal pad is soft and flexible which could reduce contact resistance between heat generators and heat sinks, transferring heat to heat spreaders effectively.


 Between an IC and a heat sink

 Between a semiconductor and heat sink

 Between power supply module and heat spreader

 Between heat-generating devices and chassis

 Hard drive cooling

 Signal amplifier cooling

 CD-ROM/DVD cooling

 LEDs, lighting

RemarkData above, which is based on lab experiments, is reliable. However, the information given here shall in no event be regarded as a guarantee of conditions or characteristics. Tests must be done to make sure that the product is suitable for your uses. For further information on technology, delivery terms and conditions and prices, please feel free to contact us. We will always do our best to help you.