HD-FS300

■ Features and Benefits

   Thermal conductivity: 3.0 W/m·K

   Excellent thermal performance

   Electrical insulating characteristics

   Low oil-bleeding

   High tack surface reduces contact resistance

   Available in die-cut parts and sheets

   Available with reinforcement carrier or non-reinforced one

   Self-adhesive

■  Thermal Pad (Gap pad)

   We has been engaging in TIM material for more than 18 years. As a leading manufacturer, we continually develop and manufacture gap-pad to meet demands of clients. We're the only one manufacturer which is able to produce 8W/m·k conductivity gap-pad in China.

   HD-FS300 thermal pads, which are made from soft silicone conductive materials, have excellent thermal and electrical insulating performance.

   HD-FS300 thermal pad is soft and flexible which could reduce contact resistance between heat generators and heat sinks, transferring heat to heat spreaders effectively.

■ Application

   Between an IC and a heat sink

   Between a semiconductor and heat sink

   Between power supply module and heat spreader

   Between heat-generating devices and chassis

   Hard drive cooling

   Signal amplifier cooling

   CD-ROM/DVD cooling

   LEDs, lighting

Remark：Data above, which is based on lab experiments, is reliable. However, the information given here shall in no event be regarded as a guarantee of conditions or characteristics. Tests must be done to make sure that the product is suitable for your uses. For further information on technology, delivery terms and conditions and prices, please feel free to contact us. We will always do our best to help you.