■ Features and Benefits
Thermal conductivity: 3.0 W/m·K
Excellent thermal performance
Electrical insulating characteristics
High tack surface reduces contact resistance
Available in die-cut parts and sheets
Available with reinforcement carrier or non-reinforced one
■ Thermal Pad (Gap pad)
We has been engaging in TIM material for more than 18 years. As a leading manufacturer, we continually develop and manufacture gap-pad to meet demands of clients. We're the only one manufacturer which is able to produce 8W/m·k conductivity gap-pad in China.
HD-FS300 thermal pads, which are made from soft silicone conductive materials, have excellent thermal and electrical insulating performance.
HD-FS300 thermal pad is soft and flexible which could reduce contact resistance between heat generators and heat sinks, transferring heat to heat spreaders effectively.
Between an IC and a heat sink
Between a semiconductor and heat sink
Between power supply module and heat spreader
Between heat-generating devices and chassis
Hard drive cooling
Signal amplifier cooling
Remark：Data above, which is based on lab experiments, is reliable. However, the information given here shall in no event be regarded as a guarantee of conditions or characteristics. Tests must be done to make sure that the product is suitable for your uses. For further information on technology, delivery terms and conditions and prices, please feel free to contact us. We will always do our best to help you.